現在包裝電子元件的外殼日益普及鋁合金材料，與傳統的塑料外殼相比，鋁合金具有更好的導熱性能、抗壓強度和耐磨性。鋁合金外殼可以有效降低電(dian)子元件(jian)的(de)工(gong)作溫度，使其(qi)更(geng)加穩定可(ke)靠。鋁(lv)合金(jin)外殼(ke)不僅可(ke)以提高(gao)電(dian)子元件(jian)的(de)壽命，而且還能使電(dian)路板(ban)的(de)性(xing)能更(geng)加穩定。鋁(lv)合金(jin)外殼(ke)與電(dian)路板(ban)之間的(de)導熱(re)性(xing)能取決(jue)于外殼(ke)材料的(de)導熱(re)系數和外殼(ke)表(biao)面粗糙(cao)度。下面介紹如何提高(gao)鋁(lv)合金(jin)外殼(ke)PCB的(de)導熱(re)性(xing)能。

　　1.提高鋁合金外殼表面(mian)粗糙度

　　鋁合金材料具有良好的導熱性能，但其表面粗糙度較大，有利于提高導熱效果。為了提高鋁合金外殼表面粗糙度，可以采取粗糙化處理或粘貼熱能加工膜的(de)方(fang)法。粗(cu)糙化處理可以(yi)通過研(yan)磨(mo)、噴(pen)丸(wan)等方(fang)法來實現。粗(cu)糙化處理使外殼(ke)表面(mian)的(de)空隙增加(jia)，進而提高了導熱性能。粘貼(tie)熱能加(jia)工(gong)膜，可以(yi)選擇導熱性能較(jiao)好的(de)膜材，如碳纖維膜、聚氨酯膜等，將其貼(tie)在外殼(ke)表面(mian)，使外殼(ke)與(yu)電路板(ban)之間(jian)的(de)接觸面(mian)積增加(jia)，從而提高導熱效果。

　　2.降低外殼材料的(de)導熱(re)系數

　　鋁(lv)合(he)金(jin)外(wai)殼PCB的導(dao)(dao)(dao)熱(re)(re)系(xi)數(shu)是(shi)外(wai)殼材(cai)料(liao)(liao)與空(kong)氣之間的熱(re)(re)傳導(dao)(dao)(dao)系(xi)數(shu)。材(cai)料(liao)(liao)的導(dao)(dao)(dao)熱(re)(re)系(xi)數(shu)越大(da)，導(dao)(dao)(dao)熱(re)(re)性(xing)能(neng)越好。要降(jiang)低(di)(di)鋁(lv)合(he)金(jin)外(wai)殼PCB的導(dao)(dao)(dao)熱(re)(re)系(xi)數(shu)，需要改變材(cai)料(liao)(liao)的結構(gou)(gou)(gou)(gou)，通常可以采(cai)取空(kong)心(xin)結構(gou)(gou)(gou)(gou)或多(duo)層(ceng)結構(gou)(gou)(gou)(gou)。將外(wai)殼材(cai)料(liao)(liao)制成(cheng)空(kong)心(xin)結構(gou)(gou)(gou)(gou)，使材(cai)料(liao)(liao)的導(dao)(dao)(dao)熱(re)(re)系(xi)數(shu)降(jiang)低(di)(di)，從而提(ti)高了外(wai)殼與電路板之間的導(dao)(dao)(dao)熱(re)(re)性(xing)能(neng)。將外(wai)殼材(cai)料(liao)(liao)制成(cheng)多(duo)層(ceng)結構(gou)(gou)(gou)(gou)，也可以降(jiang)低(di)(di)材(cai)料(liao)(liao)的導(dao)(dao)(dao)熱(re)(re)系(xi)數(shu)，從而提(ti)高導(dao)(dao)(dao)熱(re)(re)性(xing)能(neng)。

　　3.增加外殼(ke)PCB的厚度

　　外(wai)殼PCB厚(hou)(hou)度(du)(du)越(yue)厚(hou)(hou)，導(dao)(dao)熱性(xing)能越(yue)好(hao)。因此，要想(xiang)提高外(wai)殼PCB的(de)導(dao)(dao)熱性(xing)能，除(chu)了改變(bian)材料的(de)結構(gou)，增加(jia)厚(hou)(hou)度(du)(du)也(ye)是不錯的(de)方法(fa)。通常，電路板的(de)厚(hou)(hou)度(du)(du)是1mm，如果(guo)要提高導(dao)(dao)熱性(xing)能，可以將電路板的(de)厚(hou)(hou)度(du)(du)增加(jia)到2mm或(huo)3mm。

　　以上就是對如何提高鋁合金外殼PCB的導熱性能的介紹，希望對大家有所幫助。如果您還想了解更多關于電路板的知識，歡迎訪問我們的網(wang)站，我(wo)們將為(wei)您提(ti)供更多的資(zi)料(liao)。

　　Now the packaging of electronic components increasingly popular aluminum alloy housing, compared with traditional plastic housing, aluminum alloy has better thermal conductivity, compressive strength and wear resistance. Aluminum alloy housing can effectively reduce the working temperature of electronic components, making it more stable and reliable. Aluminum alloy housing can not only improve the service life of electronic components, but also make the performance of the circuit board more stable. The thermal conductivity between aluminum alloy housing and circuit board depends on the thermal conductivity coefficient of housing material and the surface roughness of housing. The following is an introduction to how to improve the thermal conductivity of aluminum alloy housing PCB.

　　1. Increase the surface roughness of aluminum alloy housing

　　Aluminum alloy material has good thermal conductivity, but its surface roughness is large, which is conducive to improving heat dissipation effect. In order to improve the surface roughness of aluminum alloy housing, roughening treatment or adhesive heat processing film can be adopted. Roughening treatment can be realized by grinding, shot peening and other methods. Roughening treatment increases the gap on the surface of the housing and improves the thermal conductivity. Adhesive heat processing film can choose film with better thermal conductivity, such as carbon fiber film, polyurethane film, etc., and paste it on the surface of the housing to increase the contact area between the housing and the circuit board, and thus improve the heat dissipation effect.

　　2. Reduce the thermal conductivity coefficient of housing material

　　The thermal conductivity coefficient of aluminum alloy housing PCB is the thermal conductivity coefficient between housing material and air. The larger the thermal conductivity coefficient of a material, the better its thermal conductivity. To reduce the thermal conductivity coefficient of aluminum alloy housing PCB, it is necessary to change the material structure. Generally, the material can be made into hollow structure or multilayer structure. Making the housing material into hollow structure can reduce the thermal conductivity coefficient of the material and improve the thermal conductivity between the housing and the circuit board. Making the housing material into multilayer structure can also reduce the thermal conductivity coefficient of the material and improve the thermal conductivity.

　　3. Increase the thickness of housing